Product category:
Electronics Manufacturing, Tools and Instruments
News Release from: Tecan
Edited by the Engineeringtalk Editorial
Team on 09 August 2001
Seminars show advantages of pin-in-hole
reflow
Tecan Stencils has announced plans to host a series of autumn seminars highlighting the advantages of pin-in-hole reflow, and extra seminars are now being planned
Tecan Stencils Limited has announced plans to host a series of autumn seminars highlighting the advantages of pin-in-hole reflow (PIHR) - the immediate response from the industry has already produced significant new orders - and extra seminars are now being planned around the country PIHR is a technology aimed at PCB producers wishing to assemble both SMT and through-hole components on the same board
This article was originally published on Engineeringtalk on 12 Mar 2001 at 8.00am (UK)
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New wafer bumping stencil boosts yields
Electroformed wafer-bumping stencils from Tecan Stencils Limited (TSL), are being used to accurately deposit solder paste directly onto silicon wafer die.
Multi-level stencils for improved PCB manufacture
TSL manufactures multi-level stencils which deliver the distinct paste volumes required by the diversity of components used on today's electronic assemblies in a single printing action.
Using a combination of multi-level stencils and reactive squeegees in a single operation, PIHR can eliminate the need for subsequent hand or wave soldering.
The technique ensures the appropriate paste volumes are deposited, for SM and through-hole components simultaneously - producing shorter product cycle times, reduced manufacturing costs and eliminating second-operation flux deposits.
Multi-level stencils offer distinct thicknesses on the same stencil, tailored to deliver the extra paste volumes required for PIHR needs, such as connectors, while also ensuring the appropriate thickness for the finest pitch SM components.
Further reading
Detailed precision parts with critical tolerances
Tecan can now electroform ultra-accurate three-dimensional parts where holes and lands may be produced up to ten times thinner than their own height - virtually impossible using any other technology
Can-on-board solder migration problems solved
Tecan Components has solved a range of problems associated with automated soldering of RFI screening cans/fences onto PCBs with the introduction of the 'Plimsoll line and lattice bridging stencils'.
Careful calculation of the appropriate individual paste volumes required is crucial, says the company, to ensure the resultant solder fillets meet acceptable quality criteria.
"We pride ourselves as always being at the forefront of screen printing technology, not just as suppliers, but hand-in-hand with leading companies and new technology development," said TSL divisional manager Tony Weldon.
"We knew the response would be big, but were surprised that it was so big - we seem to have hit upon the industry's hottest topic - certainly in PCB manufacturing." Other factors essential to the success of the technique include printing 'off pad', accurate insertion of through-hole components (with limited lead lengths), appropriate squeegee pressure and speed, and suitable thermal tolerance characteristics of the component body.
It is not always necessary to use multi-level stencils, the company can provide optimised stencils, cost-effectively, whatever the individual need.
The highly-accurate stencils can be produced by using precision etching in combination with laser cutting, or by electroforming - ensuring complete solutions combining every appropriate technique.
Using the new methods, and provided the recommended guidelines are followed, the technology is compatible with existing production techniques, personnel and processes.
The advantages, process development and hands-on implementation will be demonstrated.
The first seminar will be held at TWI North, Middlesbrough, Wednesday 12th September.
Tony Weldon, TSL, will present theoretical aspects and stencil solutions.
Consultant, industry guru and SMART Group honorary vice-president Bob Willis will review connector suitability, PIHR process development and PCB design.
For details of other seminar venues and dates, call TSL on 01305 765400.
E-mail louise.colling@tecan.co.uk.
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