Product category:
Electronics Manufacturing, Tools and Instruments
News Release from: Tecan
Edited by the Engineeringtalk Editorial
Team on 03 September 2001
New surface finishing facility on line
Tecan Components has invested £500,000 in a new high-specification surface finishing facility, offering a wide range of bespoke solutions to anyone requiring high-quality parts and plating
Tecan Components has invested £500,000 in a new high-specification surface finishing facility, offering a wide range of bespoke solutions to OEMs and niche operators requiring high-quality parts and plating Doubling previous capacity, the new unit allows the company to significantly expand its customer base and seek new applications for the services
This article was originally published on Engineeringtalk on 12 Mar 2001 at 8.00am (UK)
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New wafer bumping stencil boosts yields
Electroformed wafer-bumping stencils from Tecan Stencils Limited (TSL), are being used to accurately deposit solder paste directly onto silicon wafer die.
Multi-level stencils for improved PCB manufacture
TSL manufactures multi-level stencils which deliver the distinct paste volumes required by the diversity of components used on today's electronic assemblies in a single printing action.
The purpose-built unit concentrates on cleanliness and quality, ensuring repeatable and consistently accurate output.
Superior performance characteristics are produced on micro components, electroplated and anodised parts, for diverse applications, typically in electronics, aerospace, pharmaceutical and medical equipment markets.
Non-destructive X-ray fluorescent testing and other techniques are employed to ensure finish thickness, even over-plated layers, meets required specifications.
QA programmes can be tailored to suit individual statistical process control (SPC) needs and traceability reports generated as necessary.
As a leading photo-chemical machining (PCM) specialist, the first in the world to achieve BS EN 9002, the company offers total solutions which cannot be produced anywhere else.
Because the new plating facility is an integral part of the company, not third party sub-contracted, novel thinking can be applied to individual solutions.
For example, a US company recently believed it impossible to manufacture a small component with a selective plating requirement, because all attempts to date were based on sub-contract plating of a previously produced metal blank.
Tecan reversed the whole plating and manufacturing process to cost-effectively produce a part which perfectly met the customer specification.
Typical components produced by the company include leadframes, evaporation masks, crystal masks, hybrid lids, meshes and bespoke PCM parts requiring in-house plating.
Also, other very high-specification components requiring demanding levels of finish, both in terms of across-surface plating consistency and edge resolution.
Finishes available include acid gold, pure gold, silver, bright tin, 60/40 tin lead, sulphamate nickel, electroless nickel, copper, Type 1 sulphuric anodising and Type 3 hard anodising (colours to spec), stainless steel passivating, and Alochrome 1200 chemical blackening.
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