Product category:
Electronics Manufacturing, Tools and Instruments
News Release from: Tecan | Subject: Stepped lids
Edited by the Engineeringtalk Editorial
Team on 29 March 2002
Lids put the seal on packages
High-accuracy burr and stress-free stepped lids, essential for sealing semiconductor and optoelectronic hybrid package tubs, are now available from a single source.
High-accuracy burr and stress-free stepped lids, essential for sealing semiconductor and optoelectronic hybrid package tubs, are now available from a single source, cutting out the time and quality problems associated with contracting out specialist production elements, such as plating Specialist electronic microcomponent supplier, Tecan has developed design and manufacturing techniques which ensure manufacturers have access to the most sophisticated, technology from its complete-service facility in Weymouth, Dorset
This article was originally published on Engineeringtalk on 12 Mar 2001 at 8.00am (UK)
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New wafer bumping stencil boosts yields
Electroformed wafer-bumping stencils from Tecan Stencils Limited (TSL), are being used to accurately deposit solder paste directly onto silicon wafer die.
Multi-level stencils for improved PCB manufacture
TSL manufactures multi-level stencils which deliver the distinct paste volumes required by the diversity of components used on today's electronic assemblies in a single printing action.
Believed to be unique, the company's ability to provide all necessary manufacturing techniques under one roof, is critical in ensuring the best possible quality control and repeatable consistency available, for both flat and stepped lids.
Electroplating, for example is a function often contracted out by lid makers, a crucial area where in-house quality control ensures accuracy and repeatability.
So comprehensive is the service, that lids can be produced with no manufacturing 'tags' or 'witness marks' assuring the absolute uniformity necessary for accurate bonding to the recipient hybrid tub.
Highly accurate and proven photochemical machining techniques are used to manufacture the parts, and tooling costs are low.
The process also brings other value-added benefits at no extra cost - for example, part numbers, company contact details and other data can be readily etched onto the lid.
Typical materials include nickel alloys such as Kovar, Dilver P and Olin 194, other materials are available on request.
The company's in-house electroplating processes encompass all expected finishes - from electroless nickel, to hard-acid gold and pure-soft gold.
Cost-effective solutions for all volume levels can be supplied - with rapid prototyping available on a five-day turnround.
Tooling costs are low compared to other methods of manufacture and modifications can be quickly and cost-effectively accommodated.
Tecan operates a strict ISO9002 manufacturing regime and can manufacture to UK and overseas military specifications.
The company accepts the following CAD formats: AutoCad DXF and DWG, GraphiCodeCAM PWK and CWK, DPF, Gerber, HPGL, WMF Vector, CorelDraw Vector, Postscript and Iges.
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