Product category:
Valve Hardware (Filters, Flow Controls, Positioners etc)
News Release from: Tecan | Subject: Electroformed seives
Edited by the Engineeringtalk Editorial
Team on 24 April 2003
Process sieves meet or beat ASTM
standards
By employing leading-edge electroforming techniques, Tecan is producing high-accuracy sieves with super-fine apertures which are highly consistent across the mesh.
By employing leading-edge electroforming techniques, believed to be the most advanced in the world, Tecan is producing high-accuracy sieves with super-fine apertures which are highly consistent across the mesh The sieves can be supplied in ASTM (American Society for Testing and Materials) standard frames, and unlike traditional frames, can meet or exceed the standard's aperture tolerance requirements
This article was originally published on Engineeringtalk on 12 Mar 2001 at 8.00am (UK)
Related stories
New wafer bumping stencil boosts yields
Electroformed wafer-bumping stencils from Tecan Stencils Limited (TSL), are being used to accurately deposit solder paste directly onto silicon wafer die.
Multi-level stencils for improved PCB manufacture
TSL manufactures multi-level stencils which deliver the distinct paste volumes required by the diversity of components used on today's electronic assemblies in a single printing action.
Electroforming produces highly accurate sieves with repeatable consistency, at the lowest possible cost.
Typical applications are found in pharmaceutical, food processing, powder and bulk, medical, electronics (eg solder balls) and measurement markets demanding the highest standards.
The new sieves are fabricated in hard nickel, as opposed to the traditional soft nickel, this significantly boosts operational life, especially where abrasive materials are being processed, such as industrial diamonds.
Easy cleaning and long operational life are resultant advantages of electroforming.
Unlike traditional woven products, the single-sheet sieves do not have crossover areas, such as those found in woven-wire sieves.
This brings a range of benefits, including the elimination of contamination due to trapped debris, no de-lamination at the edges, consistent cross-sectional thickness and consistently accurate aperture shapes and sizes.
If desired, the sieves can be gold-plated, in-house, for custom needs.
Sieves can be supplied in standard 3in polycarbonate diameter frames, or 8in stainless-steel frames, the latter can be full-depth (2in) or half-depth (1in).
In all cases, the sieves may be specified with or without integral hard-nickel support grids.
Furthermore, the company can also supply sieves with no frames, again with or without integral support grids.
All apertures are highly accurate and, regardless of the aperture size, or shape (square or round), have tolerances of +/-2um.
• Tecan: contact details and other news
• Email this article to a colleague
• Register for the free Engineeringtalk email newsletter
• Engineeringtalk Home Page
Search the Pro-Talk network of sites
