Product category:
Materials and components
News Release from: Tecan | Subject: Tecan PCM process
Edited by the Engineeringtalk Editorial
Team on 25 July 2007
Metal processing techniques improve
production
New metal processes available from Tecan include titanium, lead, and polyimide etching, as well as diffusion bonding.
Original equipment manufacturers (OEMs), designers and engineers across Europe can now use the cost-effective and flexible photo-chemical machining (PCM) process for the production of even more metal components New processes available from Tecan include titanium, lead, and polyimide etching, as well as diffusion bonding
This article was originally published on Engineeringtalk on 12 Mar 2001 at 8.00am (UK)
Related stories
New wafer bumping stencil boosts yields
Electroformed wafer-bumping stencils from Tecan Stencils Limited (TSL), are being used to accurately deposit solder paste directly onto silicon wafer die.
Multi-level stencils for improved PCB manufacture
TSL manufactures multi-level stencils which deliver the distinct paste volumes required by the diversity of components used on today's electronic assemblies in a single printing action.
Applications include some of the most demanding areas in the world - from medical to defence, aerospace and bio-technology.
Tecan's PCM process is refined to the highest levels - delivering burr and stress-free custom metal parts.
Low tooling costs and rapid turnround are particularly beneficial elements of this proven process.
Further reading
Detailed precision parts with critical tolerances
Tecan can now electroform ultra-accurate three-dimensional parts where holes and lands may be produced up to ten times thinner than their own height - virtually impossible using any other technology
Can-on-board solder migration problems solved
Tecan Components has solved a range of problems associated with automated soldering of RFI screening cans/fences onto PCBs with the introduction of the 'Plimsoll line and lattice bridging stencils'.
Complex designs are as easy to tool as straight-forward requirements and in all cases tooling modifications are a simple CAD to plot process.
The technology lends itself to the fast and efficient production of prototypes and allows for down-the-line design iterations to be cost-effeciently incorporated with minimal delay.
In addition to established materials, including stainless steel, brass and copper, the company now offers titanium etched parts, such as meshes and grids, which are typically employed in fuel-cell anodes / cathodes, implantable medical devices and military equipment.
Polyimide offers beneficial chemical, electrical and mechanical properties and this can now be etched to produce flat parts such as meshes, washers, shims, gaskets and screens.
Niche areas, such as atomic energy applications, are also catered for with lead-etching.
Finally, diffusion bonding is also now offered.
The company can take photo-etched parts and diffusion bond them into simple or complex assemblies and components.
Application examples include; increasing material and strengths, providing micro channeling for cooling and delivery devices, improving flow and filtering controls and making electrical connections.
Using Computer Aided Design (CAD) tooling is generally produced from customers' own drawings and specifications.
Files are transferred to a photo plotter, where the image is accurately reproduced onto film and a 'photomaster' produced.
This photomaster can be quickly and cost-effectively replaced if modifications are required.
The company's R and D department is geared to solving the most challenging PCM projects and welcomes joint-development initiatives to produce optimised parts.
QA systems include nondestructive X-ray fluorescent testing and rigorous inspection on all components and the provision, on request, of a certificate of conformance or release note.
• Tecan: contact details and other news
• Email this article to a colleague
• Register for the free Engineeringtalk email newsletter
• Engineeringtalk Home Page
Search the Pro-Talk network of sites
