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    <pubDate>Sun, 23 Nov 2008 08:00:00 UT</pubDate>
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      <title>Cost-effective metal film thickness measurement</title>
      <description>The Mesec is a new metal film metrology instrument for copper seed and electroplated copper layers on 200 or 300mm silicon wafers.</description>
      <pubDate>Wed, 31 Jul 2002 08:00:00 UT</pubDate>
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