Product category:
Materials processing and testing
News Release from: ULVAC Technologies | Subject: Mesec
Edited by the Engineeringtalk Editorial
Team on 31 July 2002
Cost-effective metal film thickness
measurement
The Mesec is a new metal film metrology instrument for copper seed and electroplated copper layers on 200 or 300mm silicon wafers.
The Mesec is a new metal film metrology instrument for copper seed and electroplated copper layers on 200 or 300mm silicon wafers Designed for use in PVD, CVD, plating, and CMP equipment applications, the Mesec unit directly evaluates device wafers using the noncontact, nondestructive eddy current detection method
This article was originally published on Engineeringtalk on 3 Sep 2001 at 8.00am (UK)
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Copper films with thickness in the range of 0.03-5mm can be measured with the higher speed, better accuracy, and at significantly lower cost than other methods.
ULVAC's proprietary amplifier circuit design in the Mesec unit enhances the signal to noise ratio resulting in improved measurement accuracy.
Additionally, ULVAC uses a small sensor which provides a good balance between spatial resolution and background noise elimination.
ULVAC has developed two types of the Mesec units: the Mesec BIT (built-in type) and the Mesec SAT (stand-alone type).
The Mesec BIT is designed for in-situ measurements in thin film deposition systems and surface preparation equipment.
The Mesec SAT is a free-standing metrology instrument which measures any thin conductive metals or alloy films (Al, Cu, AlCu etc) on silicon wafers.
This unit features an open cassette, SMIF or FOUP loadport design and is used for inline or offline measurements.
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