Product category:
Form/co-ordinate, optical and vision instrumentation
News Release from: Umech Technologies | Subject: MMA G2
Edited by the Engineeringtalk Editorial
Team on 06 February 2003
Micro machines put to a stiffer test
The MMA G2 enables researchers to characterise and measure the three-dimensional motion of MEMS and other microstructures with subnanometre resolution, and provides real-time imaging.
The MMA G2 enables researchers to characterise and measure the three-dimensional motion of MEMS and other microstructures with subnanometre resolution, and provides real-time imaging Umech Technologies pioneered commercial MEMS motion analysis with the original development of the MMA product line
This article was originally published on Engineeringtalk on 23 Jan 2001 at 8.00am (UK)
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Building upon the original MMA, the MMA G2 provides additional features that give MEMS researchers and device processors greater testing capability and flexibility.
Specific improvements include: higher sensitivity, higher speed 1.3Mpixel imaging system allows rapid data acquisition and wide field of view; a multiple magnification lens "turret" allows rapid target identification and measurement; higher speed sampling rates and multichannel stimuli allows complex MEMS to be characterised; an order of magnitude increase in sampling of complex trajectories; networked instrument operation and expanded reporting allow remote use and data analysis; and scripting options for custom test routines in production or R and D environment.
Dr Michael Mermelstein, President of Umech Technologies commented: "The MMA G2 represents a continuation of our leadership in the field of MEMS motion analysis".
The MMA is used worldwide by leading institutes, universities and companies to aid in their MEMS research, evaluation and product development.
It measures full-field 3D motion, incorporates interferometry and profilometry and utilises sophisticated image analysis algorithms.
The MMA G2 is used in both laboratories for R and D, and is also incorporated into probe systems for wafer-level process analysis.
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