Adhesives advance structural bonding
A
Huntsman Advanced Materials product story
Edited by the Engineeringtalk editorial team
Aug 15, 2005
Companies seeking novel engineering solutions need look no further than Hall 4.0/Stand 4-40C at the Structural Bonding International section of Schweissen and Schneiden 2005.
Companies seeking novel engineering solutions need look no further than Hall 4.0/Stand 4-40C at the Structural Bonding International section of Schweissen and Schneiden 2005.
New for 2005, the Structural Bonding International section of the fair reflects the increasingly important role that adhesives bonding is playing in joining technologies.
It provides Huntsman with the perfect platform to showcase the latest technologies from its Advanced Materials Division.
On the stand, Huntsman Advanced Materials will be demonstrating how its innovative Agomet epoxy adhesives are ideally suited for bonding a range of metals and offer enhanced freedom of design in large building projects.
It will also use the event to highlight the benefits of the Araldite 2000 range.
Huntsman Advanced Materials is a leading global manufacturer and marketer of advanced epoxy resins, adhesives, coating systems, electrical insulating materials, printed circuit board technology, tooling materials and structural composites.
The division services end use markets that include the aerospace, automotive, construction, telecommunications, electrical and electronics, recreation and appliance industries.
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