Product category:
Materials and components
News Release from: Victrex USA | Subject: Victrex Peek
Edited by the Engineeringtalk Editorial
Team on 14 February 2003
Compound prevents soldering static
buildup
When Pace was designing its PS-90 soldering handpiece, it chose a Victrex Peek-based compound for the retaining nut at the end of the handpiece because of its outstanding ESD properties.
Because electrostatic discharge (ESD) can be a major problem when assembling and repairing circuit boards, it is critical that soldering systems be able to dissipate the static buildup that can damage the boards When Pace of Annapolis Junction, MD, was designing its PS-90 soldering handpiece, it chose a Victrex Peek-based carbon-fibre/glass-fibre reinforced compound for the retaining nut at the end of the handpiece because of its outstanding ESD properties
This article was originally published on Engineeringtalk on 31 Dec 2001 at 8.00am (UK)
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According to Eric Siegel, President of Pace, "Electrostatic discharge can damage electrically sensitive components.
Unlike conventional plastics that can build up a static charge, the Peek polymer ESD compound has a surface resistivity of 10e2-10e6ohm/square It is conductive to the point that static buildup is not a problem".
The retaining nut is used to hold the heater to the handpiece.
It allows the user to quickly loosen and changeout the heater when it wears out.
"Since exposure to high heat is a constant, thermal resistance was a major property requirement", says Siegel.
Peek polymer compounds have a heat distortion temperature of up to 315C which ensures that the retaining nut will remain stable throughout its operating range.
Durability was another important requirement.
"Because the retaining nut can be subjected to both lateral and axial stresses during use, we needed a material with good mechanical strength", says Siegel.
"The high tensile strength, flexural modulus, and impact characteristics of the Peek compound make the retaining nut extremely robust".
(This was Engineeringtalk's Top Story on 13 February 2003).
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