Photoelastic coating method explained
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Vishay Micro-Measurements product story
Edited by the Engineeringtalk editorial team
May 29, 2006
The authoritative book on the photoelastic coating method for experimental stress analysis has been reprinted.
Vishay Intertechnology announces that the authoritative book on the photoelastic coating method for experimental stress analysis has been reprinted.
The book, "Photoelastic coatings", written by Felix Zandman, Salomon Redner and James W Dally, was first published in 1977.
It has been reprinted under the aegis of the Society for Experimental Mechanics (formerly the Society for Experimental Stress Analysis).
Written for the practicing engineer, the book focuses on the theory, materials, instruments, and applications associated with a unique optical process used to reveal and measure the distribution of stresses in structures under live load conditions.
Photoelastic coating technology (trade name PhotoStress) is used to improve structural design in aerospace, automotive, military, civil engineering, industrial, and medical applications.
The technology was introduced in the 1950s by Dr Felix Zandman.
This technology is a part of the diverse product portfolio of Vishay Intertechnology, which was founded by Dr Zandman in 1962.
Vishay Intertechnology has grown to become one of the world's leading manufacturers of discrete semiconductors, passive electronic components, and stress measuring sensors.
Dr Zandman, through his research, publications, and lectures on the subject of photoelasticity, has made outstanding contributions to the technology of experimental mechanics.
In 1970, his efforts were honoured with a Distinguished Contribution award from the Society for Experimental Stress Analysis, and the Longstreth Medal conferred by the Franklin Institute.
Co-authors Salomon Redner and James W Dally have contributed greatly to the theory and practice of photoelasticity.
As explained in "Photoelastic coatings", many different experimental methods can be used to determine stresses and strains in machine components and structures.
Unlike other methods, PhotoStress is an optical, full-field method that provides quantitative data on stress and strain distribution over the complete area of the component submitted to live load conditions.
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