Better conduction between component and heatsink
A
Warth International product story
Edited by the Engineeringtalk editorial team
Nov 9, 2000
CM20 from Warth International provides thermal conduction between component and heatsink up to 85% more efficiently than standard silicone pads, or mica and grease solutions
The regulation of heat within the increasingly diminutive casing of telecommunication equipment is of critical importance when considering reliability and safety.
Heat generated from electrical components must be dissipated into heatsinks or the equipment chassis itself, and to do this a reliable and very conductive thermal interface material must be used between them.
CM20 from Warth International provides thermal conduction between component and heatsink up to 85% more efficiently than standard silicone pads, or mica and grease solutions.
It is constructed from compressed graphite layers, and is just 200mm thick.
The 98% graphite base gives CM20 one of the lowest thermal resistance figures available, just 0.07*C/W (inch2) and by avoiding more expensive silicone elastomer and oxide based fillers is a very cost effective solution to most heat related applications.
The electrically conductive nature of the graphite pad means that CM20 would be generally used under components or devices where electrical isolation is not an issue, but high thermal dissipation is required.
An adhesive backing can be applied to the pads, which can aid assembly and securely locate the interface material on to a component.
It can be cut to any custom or standard profile, and a range of over 150 common device profiles is available immediately.
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